Title:
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2022/210165
Kind Code:
A1
Abstract:
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 μm, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 μm, the sum of pores that are 25 μm or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 μm or greater is 20% or less with respect to the total area of the pores in the cross-section.
Inventors:
TATENO TEPPEI (JP)
KURIHARA HIROSHI (JP)
YAMAGUCHI SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
KURIHARA HIROSHI (JP)
YAMAGUCHI SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2022/013510
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/20; B24B37/24; C08J5/14; H01L21/304
Foreign References:
| JP2019069497A | 2019-05-09 | |||
| JP2019069498A | 2019-05-09 | |||
| JP2020049620A | 2020-04-02 | |||
| JP2005532176A | 2005-10-27 | |||
| JP2022056422A | 2022-04-08 |
Attorney, Agent or Firm:
KAMIMURA Yoichiro (JP)
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