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Patent Searching and Data


Title:
POLISHING PAD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/188577
Kind Code:
A1
Abstract:
The present invention provides: a polishing pad that exhibits high stability in terms of polishing rate over time; and a method for producing same. This polishing pad is equipped with a polishing layer having a polyurethane sheet, wherein a tanδ peak value change rate determined by formula: tanδ peak value change rate=|tanδ peakwet-tanδ peakdry|/tanδ peakdry×100, is not more than 15%, where tanδ peakwet represent the peak value of the loss tangent tanδ, of the polyurethane sheet in a wet state after being immersed in water for three days, within a temperature range of 20-100°C in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz, and tanδ peakdry represents the peak value of the loss tangent tanδ, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100°C in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.

Inventors:
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2019/011405
Publication Date:
October 03, 2019
Filing Date:
March 19, 2019
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/24; C08G18/10; C08G18/38; C08G18/48; C08G18/76; H01L21/304
Domestic Patent References:
WO2016084321A12016-06-02
Foreign References:
JP2016196057A2016-11-24
JP2004165408A2004-06-10
JP2015193057A2015-11-05
Attorney, Agent or Firm:
TANAKA Shinichiro et al. (JP)
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