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Patent Searching and Data


Title:
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/065619
Kind Code:
A1
Abstract:
A polishing pad comprising a polishing layer and a base layer laminated on the polishing layer, the base layer including magnetic particles.

Inventors:
MATSUOKA, Ryuma (272, Ohshinden, Saijo-sh, Ehime 42, JP)
KURIHARA, Hiroshi (272, Ohshinden, Saijo-sh, Ehime 42, JP)
NARUSHIMA, Satsuki (272, Ohshinden, Saijo-sh, Ehime 42, JP)
TAKAMIZAWA, Yamato (272, Ohshinden, Saijo-sh, Ehime 42, JP)
Application Number:
JP2020/035787
Publication Date:
April 08, 2021
Filing Date:
September 23, 2020
Export Citation:
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Assignee:
FUJIBO HOLDINGS, INC. (Nihonbashiningyocho 1-chome Chuo-k, Tokyo 13, JP)
International Classes:
B24B37/013; B24B37/24; B24B49/04; B24B49/16; H01L21/304; C08L33/02
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (23rd Floor Roppongi Hills Mori Tower, 6-10-1, Roppongi, Minato-k, Tokyo 23, JP)
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