Title:
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/065619
Kind Code:
A1
Abstract:
A polishing pad comprising a polishing layer and a base layer laminated on the polishing layer, the base layer including magnetic particles.
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Inventors:
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2020/035787
Publication Date:
April 08, 2021
Filing Date:
September 23, 2020
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/013; B24B37/24; B24B49/04; B24B49/16; H01L21/304; C08L33/02
Foreign References:
| US20040255521A1 | 2004-12-23 | |||
| JP5810802B2 | 2015-11-11 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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