Title:
POLISHING PAD, POLISHING UNIT, POLISHING DEVICE, AND METHOD FOR MANUFACTURING POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2021/193468
Kind Code:
A1
Abstract:
Provided is a polishing unit with which it is possible to reduce permeation of a polishing slurry into a substrate layer and to prevent reductions in polishing performance. A polishing unit (10a) according to a first aspect of the present invention comprises a polishing pad (100a) having a polishing layer (101) and a substrate layer (103), and a surface plate (150), the diameter of the substrate layer (103) being less than the diameter of the polishing layer (101) and being greater than the diameter of the surface plate (150).
Inventors:
TATENO TEPPEI (JP)
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2021/011502
Publication Date:
September 30, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/22; B24B37/10; B24B37/12; B24B37/24; B32B5/02; B32B5/24; B32B7/022; H01L21/304
Foreign References:
| JP2002036097A | 2002-02-05 | |||
| JPH09277163A | 1997-10-28 | |||
| JP2012238824A | 2012-12-06 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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