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Title:
POLISHING PAD FOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/151584
Kind Code:
A1
Abstract:
The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.

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Inventors:
AHN JIN WOO (KR)
Application Number:
PCT/KR2018/006352
Publication Date:
August 08, 2019
Filing Date:
June 04, 2018
Export Citation:
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Assignee:
SK SILTRON CO LTD (KR)
International Classes:
B24B37/26; B24B37/22; B24D11/00; B24D18/00
Foreign References:
JP2008229807A2008-10-02
JPH1177518A1999-03-23
KR20140014425A2014-02-06
JP2017185557A2017-10-12
KR20140062095A2014-05-22
Other References:
See also references of EP 3708299A4
Attorney, Agent or Firm:
LEE, Seung Chan (KR)
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