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Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2019/131886
Kind Code:
A9
Abstract:
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyurethane resin foam has a tanδ of 0.10-0.50 at 30°C, while having an average cell diameter of 50-120 μm.

Inventors:
SHIMIZU SHINJI (JP)
MORIOKA YOSHITAKA (JP)
YAMASAKI HITOMI (JP)
USUTANI MIYUKI (JP)
Application Number:
PCT/JP2018/048164
Publication Date:
July 23, 2020
Filing Date:
December 27, 2018
Export Citation:
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Assignee:
NITTA DUPONT INCORPORATED (JP)
International Classes:
B24B37/24; C08G18/00; C08G18/48; H01L21/304; C08G101/00
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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