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Patent Searching and Data


Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2020/021774
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a uniform polishing pad which can be manufactured in an improved work environment and has a hardness suitable for chemical mechanical polishing. Provided is a polishing pad comprising a cured body of a resin composition which contains: urethane (meth)acrylate (A); an unsaturated resin (B) composed of at least one among a vinyl ester resin and an unsaturated polyester resin; an ethylenically unsaturated compound (C) having an ethylenically unsaturated bond and excluding the urethane (meth)acrylate (A) and the unsaturated resin (B); and optionally, at most 200 parts by weight of an inorganic filler, excluding hollow bodies, with respect to 100 parts by mass in total of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C), and does not contain hollow bodies, wherein the mass ratio A:B between the content of the urethane (meth)acrylate (A) and the content of the unsaturated resin (B) is 64:36 to 96:4.

Inventors:
ISHIUCHI RYUJIN (JP)
TAKAHASHI NOBUYUKI (JP)
Application Number:
PCT/JP2019/014538
Publication Date:
January 30, 2020
Filing Date:
April 01, 2019
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
B24B37/24; C08F290/06; C08G18/67; C08J5/14; H01L21/304
Foreign References:
JP2007204651A2007-08-16
JP2009172727A2009-08-06
JP2004343090A2004-12-02
JP2018051730A2018-04-05
JP2017533585A2017-11-09
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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