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Patent Searching and Data


Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2020/203639
Kind Code:
A1
Abstract:
On the polishing surface, this polishing pad has nh grooves (nh is an integer greater than or equal to 4) having a first groove pitch x1 (mm) to an nh^th groove pitch xh (mm), wherein the absolute value of the skewness (S) represented by formula (1) is greater than or equal to 1 (in formula (1), xi is the ni^th groove pitch xi of the ni^th groove from the center, μ is the average value of the first groove pitch x1 to the nh^st pitch xh, σ represents the standard deviation of the first groove pitch x1 to the nh^st pitch xh), and the difference between the maximum value and the minimum value of the first groove pitch x1 to the nh^st pitch xh is 3-12 mm.

Inventors:
KATO MITSURU (JP)
KATO SHINYA (JP)
Application Number:
PCT/JP2020/013648
Publication Date:
October 08, 2020
Filing Date:
March 26, 2020
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B24B37/26; H01L21/304
Foreign References:
JP2012151501A2012-08-09
US6254456B12001-07-03
JP2018039078A2018-03-15
JP2005183785A2005-07-07
Attorney, Agent or Firm:
EGAWA Masaru et al. (JP)
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