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Title:
POLISHING SOLUTION, METHOD FOR PRODUCING POLISHING SOLUTION, POLISHING SOLUTION STOCK SOLUTION, POLISHING SOLUTION STOCK SOLUTION CONTAINING BODY, AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/159530
Kind Code:
A1
Abstract:
One objective of the present invention is to provide a polishing solution which is not likely to cause dishing and defects on a polished surface when applied to CMP of an object to be polished, said object containing a cobalt-containing layer. Another objective of the present invention is to provide a method for producing a polishing solution, a polishing solution stock solution, a polishing solution stock solution containing body, and a chemical mechanical polishing method. A polishing solution according to the present invention is a polishing solution for chemical mechanical polishing, which contains a colloidal silica having a degree of association of 1-3, an organic acid, an azole compound and hydrogen peroxide. If this polishing solution is in contact with a cobalt substrate for 24 hours, a reaction layer that contains cobalt atoms and has a thickness of 0.5-20 nm is formed on the cobalt substrate.

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Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
PCT/JP2018/006964
Publication Date:
September 07, 2018
Filing Date:
February 26, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
WO2014045937A12014-03-27
WO2014069457A12014-05-08
WO2014132641A12014-09-04
WO2016038995A12016-03-17
WO2015129342A12015-09-03
WO2008123373A12008-10-16
WO2010035613A12010-04-01
WO2007108153A12007-09-27
WO2016117560A12016-07-28
WO2016065057A12016-04-28
Foreign References:
JP2014060205A2014-04-03
JP2014060250A2014-04-03
JP2015043371A2015-03-05
JP2014072336A2014-04-21
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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