Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING SOLUTION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/030865
Kind Code:
A1
Abstract:
Provided is a polishing solution comprising abrasive grains, a phosphonic acid compound having a molecular weight of 210 or more, and at least one selected from the group consisting of an amino acid and an amino acid derivative, the abrasive grains having a silanol group density of 6.5/nm2 or less and a degree of association of 1.5 or more.

Inventors:
OTSUKA YUYA (JP)
IWANO TOMOHIRO (JP)
Application Number:
PCT/JP2017/028956
Publication Date:
February 14, 2019
Filing Date:
August 09, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2016158324A12016-10-06
Foreign References:
JP2011119380A2011-06-16
JP2006269910A2006-10-05
JP2013055343A2013-03-21
JP2008235652A2008-10-02
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: