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Patent Searching and Data


Title:
POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/075251
Kind Code:
A1
Abstract:
The present invention provides a polishing system that is able to polish just a portion of a region forming one flat surface of the surface of an object to be polished, and that can polish a small quantity of objects to be polished. A polishing system 1 according to one embodiment of the present invention comprises: a plurality of polishing devices 11 that are arranged side by side in a y-axis direction; and holders 13 that retain polygonal cells 9 so that the polygonal cells 9 abut respective grinding surfaces of the polishing devices 11. The grinding surfaces of the polishing devices 11 can be moved in an x-axis direction by x-axis direction movement devices 12. The holders 13 can be moved in a z-axis direction by z-axis direction movement/rotation devices 14. The holders 13 and the z-axis movement/rotation devices 14 can be moved in the y-axis direction by a y-axis direction movement device 15. The holders 13 retain the polygonal cells 9 so as to be accommodated in recessed sections of the polygonal cells 9. The z-axis movement/rotation devices 14 and the y-axis direction movement device 15 move the polygonal cells 9 in the z-axis direction and the y-axis direction during the time in which the polishing devices 11 move in the x-axis direction, the grinding surfaces of the polishing devices 11 are pushed against the polygonal cells 9, and polishing is performed.

Inventors:
YUASA KENJI (JP)
IGARASHI TAKAYUKI (JP)
Application Number:
PCT/JP2021/036597
Publication Date:
April 14, 2022
Filing Date:
October 04, 2021
Export Citation:
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Assignee:
YEP CO LTD (JP)
International Classes:
B24B47/20; B24B7/10; B24B21/00; B24B21/12; B24B41/06
Foreign References:
JP2000308951A2000-11-07
JPH05318297A1993-12-03
JPH07148648A1995-06-13
JPS60200147A1985-10-09
JP2001025951A2001-01-30
JP2020151826A2020-09-24
Attorney, Agent or Firm:
ASAHI PATENT FIRM (JP)
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