Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/045004
Kind Code:
A1
Abstract:
A polyamide imide resin which contains a structural unit (Ia) represented by formula (Ia) and a structural unit (IIa) represented by formula (IIa). In formula (Ia), each X independently represents a hydrogen atom or at least one substituent that is selected from the group consisting of a halogen atom, an alkyl group having from 1 to 9 carbon atoms, an alkoxy group having from 1 to 9 carbon atoms and a hydroxyalkyl group. In formula (IIa), each R independently represents a hydrogen atom or at least one substituent that is selected from the group consisting of an alkyl group having from 1 to 9 carbon atoms, an alkoxy group having from 1 to 9 carbon atoms and a halogen atom; and n represents an integer from 1 to 6.

More Like This:
Inventors:
HASHIMOTO GAKU (JP)
TAKEMORI DAICHI (JP)
SATOH EIICHI (JP)
SATO MIZUKI (JP)
Application Number:
PCT/JP2020/032883
Publication Date:
March 11, 2021
Filing Date:
August 31, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
C08G73/14; C08K5/00; C08L79/08; H01L23/29; H01L23/31
Foreign References:
JP2007077308A2007-03-29
JP2005146118A2005-06-09
JP2020007531A2020-01-16
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
Download PDF: