Title:
POLYAMIDE RESIN COMPOSITION FOR BONDING TO METAL, METHOD FOR PRODUCING SAME, AND HETEROGENEOUS COMPOSITE MOLDED BODY COMPRISING METAL AND MOLDED BODY CONTAINING SAID POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/131105
Kind Code:
A1
Abstract:
The present invention provides a polyamide resin composition for bonding to a metal, said composition: being able to form a molded body that is superior to molded bodies containing conventional thermoplastic resins in terms of exhibiting high bonding strength to a metal; being unlikely to undergo a reduction in this strength even in a harsh environment having a high temperature and humidity; and exhibiting airtightness at a bonding interface with a metal. The present invention relates to a polyamide resin composition for bonding to a metal having a rough surface, the composition containing cellulose fibers (B) having an average fiber diameter of 10 µm or less at a quantity of 0.1-50 parts by mass relative to 100 parts by mass of a polyamide resin (A).
Inventors:
NOGUCHI SHOTA (JP)
NAKAI MIHO (JP)
TOMOTOSHI TSUYOSHI (JP)
MURAJI KOICHI (JP)
NAKAI MIHO (JP)
TOMOTOSHI TSUYOSHI (JP)
MURAJI KOICHI (JP)
Application Number:
PCT/JP2021/045187
Publication Date:
June 23, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
C08L77/00; B29C65/06; B29C65/08; B29C65/16; B29C65/18; B32B15/088; B32B27/34; C08G69/04; C08K3/013; C08K3/34; C08K7/06; C08K7/14; C08L1/00
Domestic Patent References:
| WO2020203006A1 | 2020-10-08 |
Foreign References:
| JP2020094321A | 2020-06-18 | |||
| JP2018103387A | 2018-07-05 | |||
| JP2020114924A | 2020-07-30 | |||
| JP2019210406A | 2019-12-12 | |||
| JP2019199540A | 2019-11-21 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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