Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2020/218209
Kind Code:
A1
Abstract:
A polyamide resin composition containing a semi-aromatic polyamide (A) having a melting point of 290-330°C and a fibrous reinforcing material (B), wherein the polyamide resin composition is characterized in that the creep strain in the flow direction after 100 hours under measurement conditions of a temperature of 100°C and a tensile load of 75 MPa is 2.0% or less.
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Inventors:
ASAI MIHO (JP)
MII JUNICHI (JP)
MII JUNICHI (JP)
Application Number:
PCT/JP2020/016926
Publication Date:
October 29, 2020
Filing Date:
April 17, 2020
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
C08K7/02; C08J5/04; C08L77/06; F01D5/04
Domestic Patent References:
| WO2015053181A1 | 2015-04-16 | |||
| WO2017163408A1 | 2017-09-28 |
Foreign References:
| JP2013049793A | 2013-03-14 | |||
| JP2016102194A | 2016-06-02 | |||
| JP2018145292A | 2018-09-20 | |||
| JP2013049749A | 2013-03-14 | |||
| JP2016150992A | 2016-08-22 | |||
| JPS6363597U | 1988-04-26 | |||
| JPH02269766A | 1990-11-05 | |||
| JPH0642302A | 1994-02-15 | |||
| JPH01111102U | 1989-07-26 |
Other References:
See also references of EP 3960809A4
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
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