POLYAMIDE RESIN COMPOSITION

WIPO Patent Application WO/2018/074495

A1

[Problem] To provide a polyamide resin composition with excellent fluidity, mechanical strength, and creep behavior. [Solution] A polyamide resin composition comprising a polyamide resin (A) and an inorganic filler material (B), wherein: the polyamide resin (A) includes at least 90 mass% of polyamide 66 relative to 100 mass% of the polyamide resin, and the polyamide resin composition includes at least 30 mass% of the inorganic filler material (B) relative to 100 mass% of the composition; the solidification point of the polyamide resin composition is 210°C or higher; the spiral flow distance of the polyamide resin composition is 60 cm or longer when the amount of the inorganic filler material is 30 mass% to less than 40 mass%, is 40 cm or longer when said amount is 40 mass% to 50 mass% inclusive, and is 20 cm or longer when said amount is more than 50 mass% to 70 mass%; the polyamide resin composition exhibits a strain of 3.8% or lower in a tensile creep test of 1000 hours at 120°C and 60 MPa; and the relative viscosity (VR) in formic acid of the polyamide resin composition is 30