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Patent Searching and Data


Title:
POLYETHYLENE-BASED-RESIN COMPOSITION AND POLYETHYLENE-BASED-RESIN PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/059087
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a polyethylene-based-resin composition which, although containing an inorganic compound, has excellent formability and which gives films excellent in terms of bagmaking processability and film strength; and a polyethylene-based-resin packaging material formed from the polyethylene-based-resin composition. The polyethylene-based-resin composition comprises an inorganic compound and ethylene/α-olefin copolymers, wherein at least some of the ethylene/α-olefin copolymers is an ethylene/α-olefin copolymer A in which the α-olefin has 6-8 carbon atoms and which has a melt flow rate of 0.8-4.0 g/10 min, the composition having a content of the inorganic compound of 50-80 mass% and a content of the ethylene/α-olefin copolymer A of 10-50 mass%.

Inventors:
HORIGOME YOSHIHIRO (JP)
OSAKI MANABU (JP)
YAMAMOTO KEISUKE (JP)
NAKAGAWA YASUHIRO (JP)
Application Number:
PCT/JP2020/035049
Publication Date:
March 24, 2022
Filing Date:
September 16, 2020
Export Citation:
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Assignee:
SANIPAK COMPANY OF JAPAN LTD (JP)
International Classes:
C08L23/08; B65D30/02; C08K3/26
Foreign References:
JPH07206005A1995-08-08
JPH0517636A1993-01-26
JP2000256517A2000-09-19
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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