Title:
POLYETHYLENE MULTILLAYER BASE MATERIAL, PRINTING BASE MATERIAL, MULTILAYER BODY AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/092296
Kind Code:
A1
Abstract:
A polyethylene multilayer base material which is sequentially provided with a first polyethylene layer, a second polyethylene layer and a third polyethylene layer in this order in the thickness direction, and which is obtained by drawing, while satisfying the requirement (A) and/or the requirement (B). Requirement (A): The indentation elastic modulus of the first polyethylene layer is not less than 3.0 times the indentation elastic modulus of the second polyethylene layer; and the indentation elastic modulus of the third polyethylene layer is not less than 3.0 times the indentation elastic modulus of the second polyethylene layer.
Requirement (B): The indentation hardness of the first polyethylene layer is not less than 2.0 times the indentation hardness of the second polyethylene layer; and the indentation hardness of the third polyethylene layer is not less than 2.0 times the indentation hardness of the second polyethylene layer.
Inventors:
YAMADA KENICHI (JP)
SOEDA YUKI (JP)
IMAIZUMI MAYO (JP)
ENDO KEISUKE (JP)
SOEDA YUKI (JP)
IMAIZUMI MAYO (JP)
ENDO KEISUKE (JP)
Application Number:
PCT/JP2021/040142
Publication Date:
May 05, 2022
Filing Date:
October 29, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/00; B32B27/32; B32B27/36; B65D65/40
Domestic Patent References:
| WO2019189092A1 | 2019-10-03 |
Foreign References:
| JP2019517938A | 2019-06-27 | |||
| JPH0270433A | 1990-03-09 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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