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Patent Searching and Data


Title:
POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/098042
Kind Code:
A1
Abstract:
The present invention provides: a polyimide film having excellent dimensional stability; and a method for manufacturing same, wherein the polyimide film has a coefficient of thermal expansion of 1 ppm/°C to 5 ppm/°C, an elastic modulus of 9 GPa to 11.5 GPa, and a glass transition temperature of 340 °C to 400 °C.

Inventors:
KIM DONG-YOUNG (KR)
YOO DAE-GEON (KR)
WON DONG-YOUNG (KR)
Application Number:
PCT/KR2021/015673
Publication Date:
May 12, 2022
Filing Date:
November 02, 2021
Export Citation:
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Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
B32B15/08; C08J5/18; C08G73/10
Foreign References:
KR20190038383A2019-04-08
KR20080034876A2008-04-22
KR20200120492A2020-10-21
KR20200118027A2020-10-14
KR20110012753A2011-02-09
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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