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Patent Searching and Data


Title:
POLYIMIDE FILM AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/148394
Kind Code:
A1
Abstract:
A polyimide film that in the stacking of multilayered substrates by means of a hot press, reduces any inter-film adhesion at hinge portion, excelling in easily sliding property enabling resolution of the “squeak” trouble caused by mutual friction of films. There is provided a polyimide film having a streaked unevenness on the surface thereof and exhibiting a coefficient of static friction between film surfaces of 0.1 to 0.7, preferably having a film surface roughness (Rz) of 0.7 to 10 μm. Further, there is provided a process for producing a polyimide film, comprising subjecting a surface of polyimide film to abrasion treatment by means of a grinding roll or grinding tape to thereby form a streaked unevenness on the surface thereof.

Inventors:
SAWASAKI KOICHI (JP)
TESHIBA TOSHIHIRO (JP)
Application Number:
PCT/JP2006/312481
Publication Date:
December 27, 2007
Filing Date:
June 22, 2006
Export Citation:
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Assignee:
DU PONT TORAY CO LTD (JP)
SAWASAKI KOICHI (JP)
TESHIBA TOSHIHIRO (JP)
International Classes:
C08J5/18; B29B11/14; B29D7/01; C08L79/08
Foreign References:
JP2006182842A2006-07-13
JP2006181780A2006-07-13
JP2004231727A2004-08-19
JPH01167341A1989-07-03
JPS6198530A1986-05-16
JP2002060512A2002-02-26
JP2001233973A2001-08-28
Attorney, Agent or Firm:
IWAMI, Tomonori (Toray Industries Inc.,1-1, Sonoyama 1-chome,Otsu-sh, Shiga 58, JP)
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