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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2021/177145
Kind Code:
A1
Abstract:
A polyimide resin having a constituent unit A derived from a tetracarboxylic acid dianhydride and a constituent unit B derived from a diamine, wherein the constituent unit A includes a constituent unit (A1) derived from a compound represented by formula (a1) and a constituent unit (A2) derived from a compound represented by formula (a2), and the constituent unit B includes a constituent unit (B1) derived from a compound represented by formula (b1) and at least one constituent unit (B2) selected from the group consisting of a constituent unit (B21) derived from a compound represent by formula (b21) and a constituent unit (B22) derived from a compound represented by formula (b22).

Inventors:
ABIKO YOHEI (JP)
DAITO AOI (JP)
SEKIGUCHI SHINJI (JP)
Application Number:
PCT/JP2021/007211
Publication Date:
September 10, 2021
Filing Date:
February 25, 2021
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10
Domestic Patent References:
WO2016158825A12016-10-06
WO2020203264A12020-10-08
Foreign References:
CN108559080A2018-09-21
JP2018203906A2018-12-27
JP2003155342A2003-05-27
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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