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Patent Searching and Data


Title:
POLYMER FILM, LAMINATE AND METALLIZED LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/122352
Kind Code:
A1
Abstract:
A polymer film or the like having an elastic modulus at 60°C of 10 MPa or less, a thermal mass reduction rate at 290°C of 1.0% by mass or less and a dielectric loss tangent of 0.01 or less.

Inventors:
SASADA YASUYUKI (JP)
MUROI KANA (JP)
SHIBANO MIYOKO (JP)
Application Number:
PCT/JP2023/042082
Publication Date:
June 13, 2024
Filing Date:
November 22, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08J5/18; B32B7/02; B32B27/34; B32B27/36; C08G69/44; C08L77/12; C08L101/12; H05K1/03
Domestic Patent References:
WO2022113964A12022-06-02
WO2022181710A12022-09-01
WO2021059586A12021-04-01
WO2021251262A12021-12-16
WO2023191010A12023-10-05
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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