POLYMER MODIFIED WITH THIOL COMPOUND, PHOTO-CURABLE COMPOSITION INCLUDING SAID POLYMER, AND USE THEREFOR

Title:

POLYMER MODIFIED WITH THIOL COMPOUND, PHOTO-CURABLE COMPOSITION INCLUDING SAID POLYMER, AND USE THEREFOR

Document Type and Number:

WIPO Patent Application WO/2018/047589

Kind Code:

A1

Abstract:

The purpose of the invention is to provide a photo-curable resin composition capable of constituting a composition that has excellent adhesion to plastic base materials such as polypropylene (PP) and polyethylene terephthalate (PET), and that has excellent compatibility with ethylenically unsaturated compounds. The invention relates to a photo-curable composition characterized by comprising a polymer characterized by being obtained by modifying, with a thiol compound, an allyl-based polymer obtained by polymerizing an allyl compound represented by formula (1).

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Inventors:

UENISHI AKIHO (JP)
UMAKOSHI HIDEAKI (JP)
IWASA NARUHITO (JP)

Application Number:

PCT/JP2017/029414

Publication Date:

March 15, 2018

Filing Date:

August 15, 2017

Export Citation:

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Assignee:

OSAKA SODA CO LTD (JP)

International Classes:

C08F8/34; C08F18/16

Domestic Patent References:

WO2016104389A1

2016-06-30

Foreign References:

JP2008519110A	2008-06-05
JP2004107448A	2004-04-08
JP2000508375A	2000-07-04
JP2010079261A	2010-04-08

Attorney, Agent or Firm:

YASUTOMI & ASSOCIATES (JP)

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