Title:
POLYMER AND PROCESS
Document Type and Number:
WIPO Patent Application WO2006037556
Kind Code:
A3
Abstract:
There is disclosed a polymerisable composition comprising (a) from about 1% to about 95% by weight of the total composition of at least one polymer precursor for an alkyd, polyester, acrylic and/or epoxy polymer where the polymer precursor comprises a strong acid group in an amount from about 0.01% to about 10% by weight of the polymer precursor; (b) from about 1% to about 95% by weight of the total composition of (i) from about 50% to about 95% by weight of component (b) a monomeric melamine and/or derivative thereof optionally comprising less than 0.5% by weight of free amino groups; and (ii) from about 5% to about 50% by weight of component (b) an oligomeric melamine and/or derivative thereof (optionally formed by reacting melamine and/or a derivative thereof with formaldehyde and/or derivative thereof) where the oligomer comprises less than 0.5% by weight of free amino groups. The compositions are useful for providing melamine formaldehyde aqueous coatings which can be cured at low temperatures.
Inventors:
CHEN AUGUSTIN (US)
LEE KANG I (US)
LEE SHIH-BIN (US)
PFOHL WILLIAM F (US)
LEE KANG I (US)
LEE SHIH-BIN (US)
PFOHL WILLIAM F (US)
Application Number:
PCT/EP2005/010536
Publication Date:
June 08, 2006
Filing Date:
September 29, 2005
Export Citation:
Assignee:
CYTEC SURFACE SPECIALTIES SA (BE)
CHEN AUGUSTIN (US)
LEE KANG I (US)
LEE SHIH-BIN (US)
PFOHL WILLIAM F (US)
CHEN AUGUSTIN (US)
LEE KANG I (US)
LEE SHIH-BIN (US)
PFOHL WILLIAM F (US)
International Classes:
C08G12/42; C08L61/28; C09D161/28
Domestic Patent References:
| WO2001060882A1 | 2001-08-23 | |||
| WO2004055124A2 | 2004-07-01 |
Foreign References:
| GB2355719A | 2001-05-02 |
Other References:
DATABASE WPI Section Ch Week 198818, Derwent World Patents Index; Class A23, AN 1988-122764, XP002372598
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