Title:
POLYMER, RESIN COMPOSITION, RESIN FILM, METHOD FOR PRODUCING PATTERNED RESIN FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/031114
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition which has excellent heat resistance.
[Solution] A resin composition which contains: a polymer that contains, in one same molecule or in different molecules, a structural unit having a partial structure of formula (i) and one or more structural units selected from among structural units having a partial structure of formula (ii-1) and structural units having a phenolic hydroxyl group; and a solvent. In the formulae, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1-20 carbon atoms, a group that has at least one moiety selected from among -O- and the like in at least one carbon-carbon bond in the above-described hydrocarbon group, or a group that is obtained by substituting some hydrogen atoms in these groups; R1 and R2 may combine with each other and form a cyclic structure having 3-20 ring members together with B to which OR1 and OR2 are bonded; each of R3 and R4 independently represents a hydrogen atom, a hydrocarbon group having 1-20 carbon atoms or an electron-withdrawing group; at least one of R3 and R4 represents an electron-withdrawing group; and * represents a bonding hand.
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| JPS5493118 | IONIC POLYMER FIBER |
| WO/2021/073411 | POLYCARBONATE COMPOSITION AND PREPARATION METHOD THEREFOR AND USE THEREOF |
Inventors:
SHIMOKAWA TSUTOMU (JP)
SUGIURA MAKOTO (JP)
DOI TAKASHI (JP)
SUGIURA MAKOTO (JP)
DOI TAKASHI (JP)
Application Number:
PCT/JP2018/025282
Publication Date:
February 14, 2019
Filing Date:
July 03, 2018
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C08L101/06; C08F212/14; G03F7/023; G03F7/038; G03F7/075; G03F7/20
Domestic Patent References:
| WO2012160975A1 | 2012-11-29 | |||
| WO2012118686A2 | 2012-09-07 |
Foreign References:
| JP2014063038A | 2014-04-10 | |||
| JP2014063045A | 2014-04-10 | |||
| JP2014081502A | 2014-05-08 | |||
| JP2014137454A | 2014-07-28 | |||
| JP2014152192A | 2014-08-25 | |||
| JP2017082173A | 2017-05-18 | |||
| JP2017107024A | 2017-06-15 | |||
| JP2007506999A | 2007-03-22 | |||
| JPH08119822A | 1996-05-14 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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