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Patent Searching and Data


Title:
POLYSILICON PACKAGE
Document Type and Number:
WIPO Patent Application WO/2016/047574
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a package in which a bag formed from a polyethylene resin film having a thin thickness, more specifically, a thickness of 300 μm or less, is filled with polysilicon chunks (Si chunks), wherein damage to the bag caused by the Si chunks is effectively prevented. The present invention provides a polysilicon package in which a bag (1) formed from a polyethylene resin film having an average thickness of 300 μm or less is filled with Si chunks (4), said polysilicon package characterized in that the bag (1) has, at the bottom thereof, a section (2) joined by heat sealing, and the Si chunks (4) fill the bag (1) such that the maximum expansion of the bag (1) when the bag (1) is maintained in an upright state with the bottom thereof serving as a ground contact surface is 5% or less.

Inventors:
YOSHIMURA SATOKO (JP)
ASANO TAKUYA (JP)
Application Number:
PCT/JP2015/076623
Publication Date:
March 31, 2016
Filing Date:
September 18, 2015
Export Citation:
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Assignee:
TOKUYAMA CORP (JP)
International Classes:
B65D85/00; B65B29/00; B65D77/00; B65D77/04; B65D85/38
Foreign References:
JP2012101838A2012-05-31
JP2010528955A2010-08-26
JP2014108829A2014-06-12
JP2010036981A2010-02-18
Other References:
See also references of EP 3199472A4
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
Ono Pure in addition (JP)
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