Title:
POLYURETHANE POLISHING LAYER, POLISHING PAD CONTAINING POLISHING LAYER, METHOD FOR PREPARING POLISHING LAYER AND METHOD FOR PLANARIZING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/042428
Kind Code:
A1
Abstract:
Disclosed are a polishing pad, a polyurethane polishing layer and a preparation method therefor, belonging to the technical field of polishing in chemical mechanical planarization. The polyurethane polishing layer, wherein same has a thermal expansion coefficient of 100-200 ppm/ºC, also contains a reaction product resulting from a reaction between multiple components. The multiple components comprise an isocyanate-terminated prepolymer, a hollow microsphere polymer, and a curing agent composition. The curing agent composition comprises 5-55 wt% of an aliphatic diamine composition, 0-8 wt% of a polyamine composition, and 40-90 wt% of an aromatic difunctional composition. The polyurethane polishing layer has a density of 0.6-1.1 g/cm3, a Shore hardness of 45-70 D, and an elongation at break of 50-450%. The process for preparing the polyurethane polishing layer is simple, and has a low cost and a low energy consumption. The polyurethane polishing layer prepared by the process has a high hydrolysis stability, a uniform density and a stable removal rate.
Inventors:
ZHU SHUNQUAN (CN)
LUO YIJIE (CN)
LIU MIN (CN)
ZHANG JIPING (CN)
CHE LIYUAN (CN)
LUO YIJIE (CN)
LIU MIN (CN)
ZHANG JIPING (CN)
CHE LIYUAN (CN)
Application Number:
PCT/CN2018/103619
Publication Date:
March 07, 2019
Filing Date:
August 31, 2018
Export Citation:
Assignee:
HUBEI DINGHUI MICROELECTRONICS MAT CO LTD (CN)
International Classes:
B24B37/24; B24B37/013; B24D3/28; B24D11/00
Foreign References:
| CN103802018A | 2014-05-21 | |||
| CN105904352A | 2016-08-31 | |||
| CN101077569A | 2007-11-28 | |||
| CN1914241A | 2007-02-14 | |||
| CN107553313A | 2018-01-09 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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