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Title:
POLYVALENT (METH)ACRYLAMIDE COMPOUND AND AQUEOUS CURABLE RESIN COMPOSITION CONTAINING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/139157
Kind Code:
A1
Abstract:
Disclosed is a (meth)acrylamide compound which can be cured well by heating or irradiation of an active energy ray. The (meth)acrylamide compound has good water resistance and heat resistance after curing, and is excellent in hydrolysis resistance. In addition, the (meth)acrylamide compound is suppressed in generation of harmful substances, and can be controlled in molecular weight. Also disclosed is an aqueous curable resin composition containing such a (meth)acrylamide compound. Specifically disclosed is a polyvalent (meth)acrylamide compound having two or more (meth)acrylamide groups in a molecule. The polyvalent (meth)acrylamide compound has a carboxyl group or a group having a structure wherein a hydrogen atom of a carboxyl group is substituted by a base, while having a plurality of urethane bonds in the molecule.

Inventors:
MATSUDA YASUHIRO (JP)
FUKADA AKIHIKO (JP)
Application Number:
PCT/JP2007/061003
Publication Date:
December 06, 2007
Filing Date:
May 30, 2007
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND (JP)
MATSUDA YASUHIRO (JP)
FUKADA AKIHIKO (JP)
International Classes:
C08G18/67; C08F299/06
Foreign References:
JPH0565323A1993-03-19
JPH06184269A1994-07-05
JP2002523582A2002-07-30
JPH07102037A1995-04-18
JP2000313735A2000-11-14
JPH08165318A1996-06-25
JP2002037849A2002-02-06
Attorney, Agent or Firm:
YASUTOMI, Yasuo et al. (5-36 Miyahara 3-chome, Yodogawa-ku, Osaka-sh, Osaka 03, JP)
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