Title:
POROUS POLYURETHANE POLISHING PAD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/131868
Kind Code:
A1
Abstract:
An embodiment relates to a porous polyurethane polishing pad used in chemical mechanical planarization (CMP) of a semiconductor and a method for manufacturing same, wherein the polishing performance (polishing rate) of the porous polyurethane polishing pad can be controlled by controlling the size and the distribution of pores.
Inventors:
HEO HYE YOUNG (KR)
SEO JANG WON (KR)
HAN HYUK HEE (KR)
SEO JANG WON (KR)
HAN HYUK HEE (KR)
Application Number:
PCT/KR2018/000415
Publication Date:
July 19, 2018
Filing Date:
January 09, 2018
Export Citation:
Assignee:
SKC CO LTD (KR)
International Classes:
B24B37/24; B29C44/02; C08J9/00; C08J9/38; C08L75/04; H01L21/304
Foreign References:
| KR20100101565A | 2010-09-17 | |||
| KR20090078846A | 2009-07-20 | |||
| KR101186531B1 | 2012-10-08 | |||
| JP2010135493A | 2010-06-17 | |||
| KR100804275B1 | 2008-02-18 |
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
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