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Patent Searching and Data


Title:
POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1999/019771
Kind Code:
A1
Abstract:
A photosensitive polyimide composition soluble in organic solvents, excellent in adhesiveness, heat resistance, mechanical characteristics and flexibility, and capable of exhibiting alkali-soluble, highly sensitive positive photoresist characteristics upon irradiation with light. The composition comprises a photoacid generator and a solvent soluble polyimide exhibiting positive photosensitivity in the presence of the generator.

Inventors:
ITATANI HIROSHI (JP)
MATSUMOTO SHUNICHI (JP)
Application Number:
PCT/JP1998/004577
Publication Date:
April 22, 1999
Filing Date:
October 12, 1998
Export Citation:
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Assignee:
PI R & D CO LTD (JP)
ITATANI HIROSHI (JP)
MATSUMOTO SHUNICHI (JP)
International Classes:
C08G73/10; G03F7/004; G03F7/039; (IPC1-7): G03F7/039; G03F7/022; G03F7/004; C08L79/08; C09D179/08; C08G73/10; H05K3/28; H05K3/46; H01L21/027
Foreign References:
JPH03209478A1991-09-12
JPH0446345A1992-02-17
JPH04110348A1992-04-10
JPH04284455A1992-10-09
JPH04363361A1992-12-16
JPH0545882A1993-02-26
JPH0844062A1996-02-16
JPH08104808A1996-04-23
Other References:
See also references of EP 1024407A4
Attorney, Agent or Firm:
Tanigawa, Hidejiro (6th floor 5-12, Iidabashi 4-chome Chiyoda-ku Tokyo, JP)
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