POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

Title:

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2021/137599

Kind Code:

A1

Abstract:

A positive photosensitive resin composition and a preparation method using same are disclosed. The positive photosensitive resin composition comprises: a polymer resin comprising i) 5-95 wt% of a polyimide precursor having a structural unit represented by chemical formula 1, ii) 5-95 wt% of a polyimide having a structural unit represented by chemical formula 2, and iii) 0-20 wt% of a polyimide precursor having a structural unit represented by chemical formula 3; 5-50 parts by weight of a quinone diazide compound on the basis of 100 parts by weight of the polymer resin; and 100-2,000 parts by weight of a solvent on the basis of 100 parts by weight of the polymer resin.

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Inventors:

YOUN HYOC MIN (KR)
YEO TAI HOON (KR)
LEE GI SEON (KR)
KIM BONG HEE (KR)
KIM DONG MYUNG (KR)

Application Number:

PCT/KR2020/019343

Publication Date:

July 08, 2021

Filing Date:

December 29, 2020

Export Citation:

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Assignee:

DONGJIN SEMICHEM CO LTD (KR)

International Classes:

G03F7/039; C08L79/08; G03F7/004; G03F7/022; G03F7/037; H01L51/52

Foreign References:

KR100914064B1	2009-08-28
KR20110018668A	2011-02-24
JPS6167228A	1986-04-07

Other References:

MCKEAN D.R., ET AL.: "BASE-CATALYZED PHOTOSENSITIVE POLYMIDIE.", WATER-SOLUBLE POLYMERS: SYNTHESIS, SOLUTION PROPERTIES AND APPLICATIONS, AMERICAN CHEMICAL SOCIETY, WASHINGTON, DC, US, vol. 537., 1 January 1994 (1994-01-01), Washington, DC, US, pages 417 - 427., XP000612385, ISBN: 978-0-5412-3408-9
THIRUVASAGAM P.; SARITHA B.: "Synthesis and characterization of polyimides &co-polyimides derived from diol monomers", JOURNAL OF POLYMER RESEARCH, SPRINGER NETHERLANDS, NL, vol. 22, no. 5, 23 April 2015 (2015-04-23), NL, pages 1 - 9, XP035491136, ISSN: 1022-9760, DOI: 10.1007/s10965-015-0733-3

Attorney, Agent or Firm:

IPCJ PATENT & LAW FIRM (KR)

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