Title:
POWDER COMPOSITION, FILM, AND METHOD FOR PRODUCING FILM
Document Type and Number:
WIPO Patent Application WO/2021/095656
Kind Code:
A1
Abstract:
Provided are: a powder composition suitable for forming, by melt extrusion, films having excellent dielectric characteristics and having adhesion, processability, and low linear expansion; and a film suitable for use as a material for printed wiring boards. The powder composition comprises a powder of a tetrafluoroethylene-based polymer including a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene, a powder of an inorganic filler having a Mohs hardness of 3-9, and a powder of a thermoplastic aromatic polymer. The film comprises these ingredients and at least has a sea-island structure composed of a sea phase, which includes the aromatic polymer, and an island phase, which includes the tetrafluoroethylene-based polymer.
Inventors:
YAMABE ATSUMI (JP)
OZAWA NORIO (JP)
SATO TAKASHI (JP)
OZAWA NORIO (JP)
SATO TAKASHI (JP)
Application Number:
PCT/JP2020/041536
Publication Date:
May 20, 2021
Filing Date:
November 06, 2020
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08L27/18; C08J5/18; C08K3/013; C08L101/00
Domestic Patent References:
WO2014171029A1 | 2014-10-23 | |||
WO2015016370A1 | 2015-02-05 | |||
WO2005083007A1 | 2005-09-09 |
Foreign References:
JPH09278966A | 1997-10-28 | |||
JP2018177931A | 2018-11-15 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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