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Patent Searching and Data


Title:
POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/255558
Kind Code:
A1
Abstract:
Provided is a technique that is capable of preventing a sealing member that seals a semiconductor element from leaking from between a resin case and a heat dissipation body. A power conversion device (10) includes a heat dissipation body (40) that has a mounting surface (41) on which semiconductor elements (31 to 33) are mounted, a resin case (50) that has an adhesion surface (51) that is adhered to the mounting surface (41) and accommodates the semiconductor elements (31 to 33), and a sealing member (12) that seals the semiconductor elements (31 to 33) in the case (50). The heat dissipation body (40) has, on the mounting surface (41), a first surrounding portion (60) that surrounds the semiconductor elements (31 to 33). The case (50) has, on the adhesion surface (51), a second surrounding portion (70) that surrounds the semiconductor elements (31 to 33). The first surrounding portion (60) and the second surrounding portion (70) engage with each other through corresponding recesses and protrusions.

Inventors:
IIDA HIROAKI (JP)
TOKITA SHOGO (JP)
Application Number:
PCT/JP2020/017434
Publication Date:
December 24, 2020
Filing Date:
April 23, 2020
Export Citation:
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Assignee:
KEIHIN CORP (JP)
International Classes:
H02M7/48
Domestic Patent References:
WO2018055667A12018-03-29
Foreign References:
JPS553617A1980-01-11
JP2004349614A2004-12-09
JPS61147554A1986-07-05
JP2006081312A2006-03-23
Attorney, Agent or Firm:
SHIMODA, Yo-ichiro et al. (JP)
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