Title:
POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270013
Kind Code:
A1
Abstract:
This power conversion device comprises: a semiconductor module that has a semiconductor element; and a heat dissipation member that contacts at least one surface of the semiconductor module. The heat dissipation member has a flat shape in the interior of which a refrigerant flow path is formed. Recessed sections that are recessed in toward the the refrigerant flow path are formed on at least one surface from among a pair of principal surfaces of the heat dissipation member, said surface being on the side that contacts the semiconductor module.
Inventors:
HORIUCHI KEISUKE (JP)
NAKATSU KINYA (JP)
HISANO NAE (JP)
HIRAO TAKASHI (JP)
NAKATSU KINYA (JP)
HISANO NAE (JP)
HIRAO TAKASHI (JP)
Application Number:
PCT/JP2022/008089
Publication Date:
December 29, 2022
Filing Date:
February 25, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H02M7/48
Domestic Patent References:
| WO2012114475A1 | 2012-08-30 |
Foreign References:
| JP2013255414A | 2013-12-19 | |||
| JP2005136278A | 2005-05-26 | |||
| JP2013215080A | 2013-10-17 | |||
| JP2013175639A | 2013-09-05 | |||
| US20040062006A1 | 2004-04-01 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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