Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2014/024622
Kind Code:
A1
Abstract:
Provided is a power module with improved sealing between a metal case and a power semiconductor module. This power semiconductor module (30) is formed into an integral body by covering power semiconductor elements (31U, 31L) and peripheral side surfaces of conductor plates (33 through 36) with a first sealing resin (6). An oxide layer (rough surface layer) (46) is formed on the inner surface of the metal case (40). A fluid resin material is injected into a space (S) formed between the oxide layer (46) provided in the metal case (40) and the power semiconductor module (30) in order to form a second sealing resin (52). As the second sealing resin (52) is wedged into the recesses of the oxide layer (46), sealing is improved.
Inventors:
TAKAGI YUSUKE (JP)
MATSUSHITA AKIRA (JP)
YOSHINARI HIDETO (JP)
TSUYUNO NOBUTAKE (JP)
MATSUSHITA AKIRA (JP)
YOSHINARI HIDETO (JP)
TSUYUNO NOBUTAKE (JP)
Application Number:
PCT/JP2013/068806
Publication Date:
February 13, 2014
Filing Date:
July 10, 2013
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H02M7/48; H01L25/07; H01L25/18
Foreign References:
| JP2012138409A | 2012-07-19 | |||
| JP2010258315A | 2010-11-11 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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