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Patent Searching and Data


Title:
PRE-WETTING LIQUID, RESIST FILM FORMING METHOD, PATTERN FORMING METHOD, AND KIT
Document Type and Number:
WIPO Patent Application WO/2021/059862
Kind Code:
A1
Abstract:
The present invention provides a pre-wetting liquid that has excellent resist saving properties. The present invention also provides a resist film forming method, a pattern forming method, and a kit, which are related to the above-described pre-wetting liquid. A pre-wetting liquid according to the present invention has a surface tension of 29.0 mN/m or more, a viscosity of 1.8 cP or less and a vapor pressure of from 2.5 mmHg to 5.0 mmHg; if this pre-wetting liquid is composed of a single solvent, the single solvent has an SP value of 25.0 MPa1/2 or less, while having no benzene ring group; and if this pre-wetting liquid is composed of a mixed solvent, the requirement 1 or the requirement 2 is satisfied. Requirement 1: The mixed solvent is composed only of two or more organic solvents A, and the organic solvents A have an SP value of 25.0 MPa1/2 or less and a surface tension of 29.0 mN/m or more, while having no benzene ring group. Requirement 2: The mixed solvent is obtained by mixing an organic solvent A and an organic solvent B, and the organic solvent B has an SP value of 25.0 MPa1/2 or less and a surface tension of less than 29.0 mN/m.

Inventors:
TAKAHASHI SATOMI (JP)
Application Number:
PCT/JP2020/032580
Publication Date:
April 01, 2021
Filing Date:
August 28, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B05C9/10; B05D3/10; B05D7/24; G03F7/038; G03F7/039; G03F7/16; G03F7/20; H01L21/027
Domestic Patent References:
WO2018180735A12018-10-04
WO2019009363A12019-01-10
WO2018092760A12018-05-24
WO2018043690A12018-03-08
WO2016181753A12016-11-17
Foreign References:
JP2004039828A2004-02-05
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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