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Title:
PRE-WETTING LIQUID, RESIST FILM FORMING METHOD, PATTERN FORMING METHOD, AND KIT
Document Type and Number:
WIPO Patent Application WO/2021/059895
Kind Code:
A1
Abstract:
The present invention provides a pre-wetting liquid which is capable of forming a resist film that has excellent in-plane uniformity, and which enables the formation of a pattern that is excellent in terms of suppression of defects. The present invention also provides a resist film forming method, a pattern forming method, and a kit, which are related to the above-described pre-wetting liquid. A pre-wetting liquid according to the present invention has a surface tension of 29.0 mN/m or more, a viscosity of 1.8 cP or less and a vapor pressure of from 2.5 mmHg to 5.0 mmHg; this pre-wetting liquid contains one or more organic solvents, water and metal ions; each organic solvent contained in the above-mentioned one or more organic solvents has an SP value of 26.0 MPa1/2 or less; the content of the above-mentioned one or more organic solvents is 98% by mass or more relative to the total mass of this pre-wetting liquid; the content of the water is from 0.1 ppm by mass to 500 ppm by mass relative to the total mass of this pre-wetting liquid; and the content of the metal ions is from 0.1 ppt by mass to 200 ppt by mass relative to the total mass of this pre-wetting liquid.

Inventors:
TAKAHASHI SATOMI (JP)
SHIMIZU TETSUYA (JP)
Application Number:
PCT/JP2020/033084
Publication Date:
April 01, 2021
Filing Date:
September 01, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B05D3/10; B05D7/24; G03F7/038; G03F7/039; G03F7/16; G03F7/20; H01L21/027
Domestic Patent References:
WO2018092760A12018-05-24
WO2018151164A12018-08-23
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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