Title:
PREPARATION PROCESS OF POWER TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/056604
Kind Code:
A1
Abstract:
A preparation process of a power type semiconductor device package structure, comprising the following steps: providing at least one insulating plate (10) coated with conductive layers on both sides, and at least one flexible conductive layer (5); enabling one surface of the insulating plate (10) to be connected to a first terminal of a chip component (4) and enabling a C electrode of a semiconductor device to be connected to the first terminal; and enabling the other surface of the insulating plate (10) to be connected to the flexible conductive layer by means of a first conductive protrusion, enabling an E electrode of the semiconductor device to be connected to a second terminal of the chip component (4), and enabling the flexible conductive layer (5) to be connected to the E electrode.
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| JPS5946101 | [Title of the Invention] A mounting method of a semiconductor device |
| WO/2017/154195 | SEMICONDUCTOR DEVICE |
Inventors:
QIU YUFENG (CN)
LI XIANBING (CN)
ZHAO ZHIBIN (CN)
WU JUNMIN (CN)
ZHANG PENG (CN)
ZHANG LEI (CN)
TANG XINLING (CN)
LI XIANBING (CN)
ZHAO ZHIBIN (CN)
WU JUNMIN (CN)
ZHANG PENG (CN)
ZHANG LEI (CN)
TANG XINLING (CN)
Application Number:
PCT/CN2019/109577
Publication Date:
April 01, 2021
Filing Date:
September 30, 2019
Export Citation:
Assignee:
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD (CN)
International Classes:
H01L23/48
Foreign References:
| CN110556349A | 2019-12-10 | |||
| CN108172617A | 2018-06-15 | |||
| CN108520870A | 2018-09-11 | |||
| CN107622954A | 2018-01-23 | |||
| US20170162466A1 | 2017-06-08 | |||
| CN105789157A | 2016-07-20 | |||
| CN105957888A | 2016-09-21 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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