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Title:
PREPARATION PROCESS OF POWER TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/056604
Kind Code:
A1
Abstract:
A preparation process of a power type semiconductor device package structure, comprising the following steps: providing at least one insulating plate (10) coated with conductive layers on both sides, and at least one flexible conductive layer (5); enabling one surface of the insulating plate (10) to be connected to a first terminal of a chip component (4) and enabling a C electrode of a semiconductor device to be connected to the first terminal; and enabling the other surface of the insulating plate (10) to be connected to the flexible conductive layer by means of a first conductive protrusion, enabling an E electrode of the semiconductor device to be connected to a second terminal of the chip component (4), and enabling the flexible conductive layer (5) to be connected to the E electrode.

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WO/2000/068992SEMICONDUCTOR DEVICE
WO/2017/154195SEMICONDUCTOR DEVICE
Inventors:
QIU YUFENG (CN)
LI XIANBING (CN)
ZHAO ZHIBIN (CN)
WU JUNMIN (CN)
ZHANG PENG (CN)
ZHANG LEI (CN)
TANG XINLING (CN)
Application Number:
PCT/CN2019/109577
Publication Date:
April 01, 2021
Filing Date:
September 30, 2019
Export Citation:
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Assignee:
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD (CN)
International Classes:
H01L23/48
Foreign References:
CN110556349A2019-12-10
CN108172617A2018-06-15
CN108520870A2018-09-11
CN107622954A2018-01-23
US20170162466A12017-06-08
CN105789157A2016-07-20
CN105957888A2016-09-21
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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