PREPREG, MOLDED ARTICLE, AND INTEGRALLY MOLDED ARTICLE

WIPO Patent Application WO/2022/158222

A1

The present invention addresses the problem of providing: a prepreg which exhibits appropriate flexibility and adhesiveness, has excellent formativeness to a complex mold surface, has excellent adhesion to the mold surface, does not cause displacement of the prepreg, and can be efficiently reinforced and stiffened at a target location; and an integrally molded body. The prepreg comprises (A) a reinforcing fiber, (B) a thermosetting resin, and (C) a thermoplastic resin, wherein (C) the thermoplastic resin is present on at least a part of the surface of the prepreg, and the prepreg satisfies conditions [I] and (II). [I]: (B) The thermosetting resin has a peak in a temperature range of 100°C to 180°C (exclusive of 100) in a loss tangent tanδ curve measured at a constant temperature rising rate via a dynamic viscoelasticity measurement (DMA method). [II]: A loss angle δ curve is obtained by performing isothermal measurement on said prepreg via the dynamic viscoelasticity measurement (DMA method), and the loss angle δ curve has a point indicating the maximum value, and also has a point which is on a shorter-time side relative to the point indicating the maximum value, and which indicates a loss angle δ of at least 5° smaller than the maximum value.

ONODERA MIHO (JP)
TAKEBE YOSHIKI (JP)
NAITO YUTA (JP)
MISUMI JUN (JP)
NAKAYAMA YOSHIFUMI (JP)
HONMA MASATO (JP)

PCT/JP2021/047257

July 28, 2022

December 21, 2021

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TORAY INDUSTRIES (JP)

C08J5/24; B32B5/10

WO2020235487A1

2020-11-26

JP2012086578A	2012-05-10
JP2004315743A	2004-11-11
JP2016113472A	2016-06-23
JP2018161801A	2018-10-18
JPH10138354A	1998-05-26

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