Title:
PRESSURE-SENSITIVE ADHESIVE ATTACHING DEVICE AND ATTACHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/036029
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive attaching device, comprising: a machine base (1) supporting a first substrate to which pressure-sensitive adhesive is to be attached, a control unit being provided on the machine base; and an infrared drying device (2) comprising an infrared heat source (22). The infrared heat source is provided at a position on the surface of the pressure-sensitive adhesive at a preset height, and the preset height is adjustable. The control unit is used for controlling the heating of the infrared drying device and the relative movement between the infrared drying device and the machine base. Also included is an attaching method for the pressure-sensitive adhesive attaching device above. The pressure-sensitive adhesive attaching device has the advantages of having accurate temperature control and convenient and fast use, and ensuring a consistent and stable adhesive surface temperature.
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Inventors:
GUO YOUCHENG (CN)
Application Number:
PCT/CN2019/120075
Publication Date:
March 04, 2021
Filing Date:
November 22, 2019
Export Citation:
Assignee:
SUZHOU HI TECH ELECTRONICS CO LTD (CN)
International Classes:
B65H37/04; B32B37/06
Foreign References:
| CN109504293A | 2019-03-22 | |||
| CN105499054A | 2016-04-20 | |||
| CN106497446A | 2017-03-15 | |||
| CN208745487U | 2019-04-16 | |||
| CN102511060A | 2012-06-20 | |||
| CN106079818A | 2016-11-09 | |||
| US9242441B1 | 2016-01-26 |
Attorney, Agent or Firm:
SUZHOU HUABO INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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