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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, COPOLYMER DISPERSION FOR USE IN PREPARING PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE TAPE, METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE TAPE, BONDING METHOD, AND SET FOR USE IN PREPARING PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/058564
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive composition comprising: a copolymer (A) comprising a structural unit derived from one or more monomers (a1), which are a monomer having an alkoxysilyl group and/or a monomer having an epoxy group, and a structural unit derived from a monomer (a2), which has a functional group reactive with the following crosslinking agent (B); a crosslinking agent (B) comprising at least one compound selected from the group consisting of polycarbodiimide compounds, polyepoxy compounds, and polyisocyanate compounds; and an aqueous medium. The pressure-sensitive adhesive composition satisfies the following requirements (1) and (2). Requirement (1): 3.0×105 Pa ≤ G'(20) ≤ 5.0×105 Pa Requirement (2): 6.0×104 Pa ≤ G'(80) ≤ 9.0×104 Pa The G'(20) is the shear storage modulus of a pressure-sensitive adhesive made of a cured object from the pressure-sensitive adhesive composition, as measured under the conditions of a temperature of 20°C and a frequency of 10 Hz, and the G'(80) is the shear storage modulus of the pressure-sensitive adhesive made of a cured object from the pressure-sensitive adhesive composition, as measured under the conditions of a temperature of 80°C and a frequency of 10 Hz.

Inventors:
SAITO MIKI (JP)
OKUHARA KENTA (JP)
Application Number:
PCT/JP2022/036631
Publication Date:
April 13, 2023
Filing Date:
September 30, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/21; C09J133/00; C09J7/38
Foreign References:
JP2017025200A2017-02-02
JP2008297539A2008-12-11
JP2002309212A2002-10-23
JP2001131511A2001-05-15
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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