PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, AND OPTICAL LAMINATE

WIPO Patent Application WO/2020/250749

A1

Provided are: a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer that enables release films provided on both surfaces thereof to be satisfactorily removed; the pressure-sensitive adhesive layer; a pressure-sensitive adhesive sheet; and an optical laminate. This pressure-sensitive adhesive composition contains a resin, a crosslinking agent, and a silane compound. The silane compound includes a Si-O-Si bond in the main chain. Both ends of the main chain of the silane compound each include a functional group other than a hydrolyzable group. A side chain of the silane compound includes a functional group other than a carboxyl group. The silane compound is preferably a leveling agent.

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KUMON KOUJI (JP)
SASE MITSUTAKA (JP)
IWATA TOMO (JP)

PCT/JP2020/021716

December 17, 2020

June 02, 2020

Click for automatic bibliography generation  

SUMITOMO CHEMICAL CO (JP)

C09J11/06; C09J7/10; C09J7/38; C09J11/08; C09J133/00; C09J201/00; G02B5/30; G02F1/1335

WO2012157759A1

2012-11-22

JP2017069476A	2017-04-06
JP2015000959A	2015-01-05
JP2016207944A	2016-12-08
JP2008503639A	2008-02-07
JP2016035046A	2016-03-17
JP2017218594A	2017-12-14
JP2013028006A	2013-02-07
JP2013231157A	2013-11-14
JPH08199139A	1996-08-06
US20020012678A1	2002-01-31

NAKAYAMA, Tohru et al. (JP)

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