Title:
PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/065073
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive sheet (10) has a base material (11) and a pressure-sensitive adhesive layer (12), wherein the pressure-sensitive adhesive layer (12) includes an energy ray-curable resin, an elongation at break in a displacement-stress curve of the pressure-sensitive adhesive layer (12) alone is 1500% or more, and when the displacement of the pressure-sensitive adhesive layer (12) alone in the displacement-stress curve is 1500%, the stress is 0.100 MPa or less.
Inventors:
TAKANO KEN (JP)
Application Number:
PCT/JP2020/020330
Publication Date:
April 08, 2021
Filing Date:
May 22, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J4/00; C09J7/38; H01L21/683
Domestic Patent References:
| WO2018181511A1 | 2018-10-04 | |||
| WO2012124389A1 | 2012-09-20 | |||
| WO2016140163A1 | 2016-09-09 | |||
| WO2019172219A1 | 2019-09-12 | |||
| WO2019181732A1 | 2019-09-26 |
Foreign References:
| JP2018159014A | 2018-10-11 | |||
| JP2014232251A | 2014-12-11 | |||
| JP2010229342A | 2010-10-14 | |||
| JP2009138183A | 2009-06-25 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Download PDF: