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Patent Searching and Data


Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/037699
Kind Code:
A1
Abstract:
Provided is a pressure sensor having high electrostatic resistance. This pressure sensor comprises a substrate and a covering member. The substrate has a diaphragm, and a support part that surrounds the diaphragm as seen from the thickness direction of the diaphragm. The covering member covers one surface of the diaphragm such that a measurement space is formed between the covering member and the diaphragm, the covering member being joined to the support part of the substrate. The diaphragm flexes due to pressure applied to the one surface of the diaphragm. A communication orifice that allows the measurement space and the exterior to communicate with one another is formed in the covering member. The covering member is grounded.

Inventors:
UCHIDA MAMI (JP)
HAMAZAKI RYOHEI (JP)
Application Number:
PCT/JP2022/025166
Publication Date:
March 16, 2023
Filing Date:
June 23, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L9/00
Foreign References:
JPS62145130A1987-06-29
US20140338459A12014-11-20
JP2017166857A2017-09-21
JP2009512202A2009-03-19
US20150061048A12015-03-05
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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