Title:
PRIMER COMPOSITION FOR ELECTROLESS PLATING, PRIMER MEMBER FOR ELECTROLESS PLATING, AND PLATED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/039282
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a primer composition for electroless plating, which exhibits superior adhesiveness to a resin base material with poor adhesiveness such as polybutylene terephthalate or polyphenylene sulfide, as well as to a plated metal film deposited by electroless plating, and, when used as a primer layer, can appropriately form a plated metal film having a good surface state. The primer composition for electroless plating is characterized by comprising (A) 100 parts by weight of polyester (excluding polyester urethane) that has a glass transition temperature of 0 to 20°C and a hydroxyl value of 2 to 10 mg KOH/g, (B) 5 to 40 parts by weight of polymethylene phenyl polyisocyanate, and (C) an organic solvent.
Inventors:
YASUE HIDEKUNI (JP)
Application Number:
PCT/JP2015/075303
Publication Date:
March 17, 2016
Filing Date:
September 07, 2015
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C23C18/20; C09D5/00; C09D167/00; C09D175/06; H05K9/00
Domestic Patent References:
| WO2007108351A1 | 2007-09-27 |
Foreign References:
| JP2012241208A | 2012-12-10 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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