Title:
PRIMER COMPOSITION FOR ELECTROLESS PLATING, PRIMER MEMBER FOR ELECTROLESS PLATING, AND PLATED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/039283
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a primer composition for electroless plating, which exhibits excellent adhesion to a poorly adhesive resin base such as a polybutylene terephthalate and a polyphenylene sulfide and to a plating metal film that is deposited by electroless plating, and which enables suitable formation of a plating metal film having a good surface state in cases where this primer composition for electroless plating is formed into a primer layer.
A primer composition for electroless plating according to the present invention is characterized by containing:
(A) 100 parts by weight of a polyester having a glass transition temperature of 0-20°C and a hydroxyl number of 2-10 mgKOH/g (excluding polyester urethanes);
(B) 5-40 parts by weight of a polymethylenephenyl polyisocyanate;
(C) an inorganic filler having an average primary particle length of 1-5 μm and an aspect ratio of 3 or more in an amount of 45-75% by weight relative to the total solid content; and
(D) an organic solvent.
Inventors:
YASUE HIDEKUNI (JP)
Application Number:
PCT/JP2015/075306
Publication Date:
March 17, 2016
Filing Date:
September 07, 2015
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C23C18/20; C09D5/00; C09D167/00; C09D175/06; H05K9/00
Domestic Patent References:
| WO2007108351A1 | 2007-09-27 |
Foreign References:
| JP2012241208A | 2012-12-10 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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