Title:
PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2021/091166
Kind Code:
A1
Abstract:
The present disclosure relates to a printed circuit board and an electronic apparatus including same. The printed circuit board according to an embodiment of the present disclosure may comprise: a first ground layer including at least one first opening; a wiring layer which is spaced apart from the first ground layer and has a signal wiring pattern formed thereon; and an insulating layer disposed between the first ground layer and the wiring layer, wherein the signal wiring pattern includes first regions having a first width and second regions having a second width different from the first width, the first regions and the second regions are alternately arranged, and the first regions are arranged at positions corresponding to the first openings.
Inventors:
PARK SUNGWON (KR)
Application Number:
PCT/KR2020/014938
Publication Date:
May 14, 2021
Filing Date:
October 29, 2020
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; H05K1/11
Foreign References:
| JP2016131375A | 2016-07-21 | |||
| KR20180080611A | 2018-07-12 | |||
| JP2005244029A | 2005-09-08 | |||
| JP2007123740A | 2007-05-17 | |||
| JP2016004875A | 2016-01-12 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
Download PDF:
Previous Patent: ORGANIC LIGHT-EMITTING DEVICE
Next Patent: GALVANIZED STEEL SHEET HAVING EXCELLENT WORKABILITY AND MANUFACTURING METHOD THEREFOR
Next Patent: GALVANIZED STEEL SHEET HAVING EXCELLENT WORKABILITY AND MANUFACTURING METHOD THEREFOR