Title:
PRINTED CIRCUIT BOARD HAVING HIGH-SPEED OR HIGH-FREQUENCY SIGNAL CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2017/105019
Kind Code:
A1
Abstract:
A printed circuit board includes a substrate including a surface layer and a first ground layer; a high-frequency signal generation part provided in the surface layer of the substrate; at least one high-frequency signal connector mounting portion formed in the surface layer of the substrate; at least one high-frequency signal line formed in the surface layer of the substrate, and extend from the high-frequency signal generation part to the at least one high-frequency signal connector mounting portion; and at least one high-frequency signal connector disposed in the at least one high-frequency signal connector mounting portion, wherein an end of the first ground layer is exposed to a side surface of the substrate, and when the high-frequency signal connector is disposed in the at least one high-frequency signal connector mounting portion, a ground of the high-frequency signal connector is in contact with the end of the first ground layer.
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Inventors:
CHO YONG-HEE (KR)
Application Number:
PCT/KR2016/014211
Publication Date:
June 22, 2017
Filing Date:
December 06, 2016
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01R13/646; H01R12/72; H01R13/648; H01R24/38; H05K1/02; H01R101/00
Foreign References:
| US20120088402A1 | 2012-04-12 | |||
| US20110217853A1 | 2011-09-08 | |||
| JP2000353559A | 2000-12-19 | |||
| US20080102654A1 | 2008-05-01 | |||
| US20040038587A1 | 2004-02-26 |
Attorney, Agent or Firm:
JEONG, Hong-sik (KR)
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