Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/080305
Kind Code:
A1
Abstract:
A printed circuit board according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer and comprising a cavity; and a pad disposed on the first insulating layer and of which an upper surface is exposed through the cavity, wherein the cavity comprises: a first part comprising a first inner wall; and a second part comprising a second inner wall under the first part, wherein the angle of inclination of the first inner wall is different from the angle of inclination of the second inner wall.
Inventors:
SHIN JONG BAE (KR)
LEE SOO MIN (KR)
JEONG JAE HUN (KR)
LEE SOO MIN (KR)
JEONG JAE HUN (KR)
Application Number:
PCT/KR2020/014386
Publication Date:
April 29, 2021
Filing Date:
October 21, 2020
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/18; H05K1/11; H05K3/00; H05K3/46
Foreign References:
| JP2012164952A | 2012-08-30 | |||
| KR101613525B1 | 2016-04-20 | |||
| KR20140128058A | 2014-11-05 | |||
| US20170055349A1 | 2017-02-23 | |||
| KR20080046275A | 2008-05-26 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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