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Patent Searching and Data


Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/200820
Kind Code:
A1
Abstract:
This printed wiring board comprises an insulating substrate 1 and a conductor portion 3 disposed at least inside the insulating substrate 1. The insulating substrate 1 has a plurality of stacked insulating layers. The insulating substrate 1 has a through-hole 7 penetrating therethrough from a first opening thereof to a second opening thereof in the thickness direction. The conductor portion 3 includes a plurality of conductor layers 9 and a through-hole conductor 11. The plurality of conductor layers 9 are respectively positioned along the insulating layers 5 in a planar direction. The through-hole conductor 11 has a tubular shape extending from the first opening toward the second opening. The through-hole conductor 11 at an existing position is electrically connected to some of the plurality of conductor layers 9. The plurality of conductor layers 9 include at least one layer of a non-connected conductor layer closer to the second opening than to the through-hole conductor 11 which is not in contact with the through-hole conductor 11. The through-hole conductor 11, in a cross-sectional view taken along the central axis of the through-hole 7, has two end portions closer to the second opening, including a first end portion and a second end portion that have different positions in the thickness direction.

Inventors:
MATSUMOTO KEISAKU (JP)
Application Number:
PCT/JP2021/013285
Publication Date:
October 07, 2021
Filing Date:
March 29, 2021
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/11; H05K3/42; H05K3/46
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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