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Title:
PRINTING MACHINE AND PRINTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/017776
Kind Code:
A1
Abstract:
In the present invention, the position where a solder 14 is to be printed on a substrate 10 is corrected by changing, corresponding to the position of a squeegee 53 with respect to a mask 12, the relative positional relationship between the mask 12 and the substrate 10 in the squeegee direction D53. Consequently, a positional shift of the solder 14 to be printed on the mask 12 can be suppressed.

Inventors:
NARITA YOSHITAKA (JP)
HOOGERS BART (DE)
Application Number:
PCT/JP2015/071315
Publication Date:
February 02, 2017
Filing Date:
July 28, 2015
Export Citation:
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Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
B41F15/40; B41F15/08; B41F33/00
Foreign References:
JPS61146540A1986-07-04
JP2011151222A2011-08-04
JP2011201023A2011-10-13
JPH03187746A1991-08-15
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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